Nexperia: Flip-Chip ESD Protection for Automotive
Nexperia Introduces High Signal Integrity ESD Protection Diodes in Innovative FC-LGA Packaging for Automotive Applications
Nexperia has unveiled a groundbreaking portfolio of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes, housed in innovative flip-chip land-grid-array (FC-LGA) packaging. This cutting-edge package technology is meticulously designed to protect and filter high-speed data communication links, which are increasingly prevalent in modern automotive systems. Applications such as in-vehicle camera video links, multi-gigabit automotive Ethernet networks, and infotainment interfaces like USBx, HDMIx, and PCIex can now be effectively shielded from potentially damaging ESD events.
Flip-chip packages offer significant advantages, including minimal parasitic components, eliminating bond wires and copper lead frames, resulting in superior performance and exceptional signal integrity. Nexperia's new 2- and 3-pin FC-LGA diodes boast ultra-low capacitance (<0.25 pF) and insertion loss (-3 dB at 14.6 GHz), critical attributes for high data rate applications. Both flip-chip packages, the 2-pin DFN1006L(D)-2 and the 3-pin DFN1006L(D)-3, maintain the same footprint as their standard counterparts, ensuring seamless drop-in compatibility. These diodes offer up to 6 GHz bandwidth improvement compared to conventional DFN technologies. Furthermore, the 3-pin devices' ability to protect two channels and provide capacitance matching optimizes space utilization while enhancing circuit performance and stability.
In addition to delivering best-in-class signal integrity, this family of diodes offers the industry's widest range of reverse working voltages (Vrwm), including 5V, 18V, 24V, and 30V options. Higher voltage devices provide the flexibility for strategic board placement, protecting multiple devices connected at various points along a link. Notably, products like the PESD5V0H1BLG-Q in DFN1006LD-2 and PESD5V0H2BFG-Q in DFN1006LD-3 packaging make Nexperia the sole supplier of ESD protection diodes in flip-chip packaging with side-wettable flanks (SWF). This feature enables automated optical inspection (AOI) of solder joints, ensuring adherence to the stringent quality requirements of the automotive industry, where safety is paramount.
"These new diodes combine side-wettable flanks with a DFN1006 footprint, optimized for maximum signal integrity, representing a significant advancement over existing options," stated Alexander Benedix, Head of Product Group Protection and Filtering at Nexperia. "Designed to support the growing trend of data-intensive automotive applications, they reflect Nexperia's proven expertise in packaging technology. This launch underscores our commitment to delivering innovative solutions that meet the evolving demands of engineers across a wide range of industries."
The initial three 5V Flip-Chip diodes are currently in mass production. Six additional products, featuring 18V, 24V, and 30V options, are undergoing sampling and will be available for mass production in Q2 2025.
BonChip Electronics: Your Trusted Nexperia Component Distributor
BonChip Electronics is proud to offer Nexperia’s advanced ESD protection diodes, including the innovative FC-LGA packaged solutions. We are dedicated to providing our customers with exceptional service, competitive pricing, and efficient delivery. Whether you require standard components or the latest high-performance solutions, BonChip Electronics is your reliable partner.
